Software Engineer – Physical Design & 3D Packaging

About the role

Siemens EDA is seeking a Software Engineer to join the CES‑3DIC team in Cairo. The role focuses on developing and enhancing software modules for physical design, place‑and‑route and 3D packaging of advanced System‑in‑Package (SiP) solutions, integrating EDA and MCAD tools to support chip, board and system design.

Key responsibilities

• Design, implement, test and document software components for physical design, place‑and‑route and 3D packaging workflows.
• Develop scalable scripts and automation using Python, Tcl/Tk, Bash and other tools to streamline design flows.
• Identify and resolve complex issues in physical implementation, packaging, tool integration or workflow automation.
• Improve flows for floorplanning, placement, routing, power and signal integrity, and physical verification for 3D ICs.
• Collaborate with CAD, packaging and physical implementation teams to drive innovation.
• Maintain design data, EDA infrastructure, tool installations and server environments on Linux and Windows.

Required profile

• Bachelor’s degree in Computer Science, Computer Engineering, Electrical Engineering or related field with 4+ years experience, or a Master’s degree with 2+ years experience.
• Strong problem‑solving abilities applied to physical design and packaging challenges.

Required skills

• Proficiency in Python, Tcl/Tk and Bash/Shell scripting.
• Experience with software development in Linux and Windows environments.
• Knowledge of flow managers and Makefiles for building complex design structures.
• Familiarity with CAD/EDA tools and 3D/2.5D packaging concepts.